PaulStoffregen
Well-known member
Now that NXP has publicly announced the IMXRT1170 chip, we can finally start talking about far-future (late 2020 -- EDIT: time frame unknown.....) features and form factors and pinouts.
EDIT Again: every appearance is these new IMXRT117X chips will not be in volume production until the end of 2021 or early 2022.
EDIT Yet Again: these chips are still not in stock at the beginning of 2022, and we're now about 9 months into a severe global shortage of nearly all chips. When PJRC will be able to launch another Teensy model is looking uncertain, but the first half of 2022 is looking extremely unlikely to alleviate the shortages of nearly all chips on the market.
I'm definitely planning to make a larger form factor Teensy with the 1170 chip.
I'm also considering making Teensy 4.1 with the same chip (or 12 mm package size) as we have on Teensy 4.0, but in the Teensy 3.6 form factor so we can have access to more pins and features. If Teensy 4.1 is made (still "if" at this point), it would be early 2020 time frame. EDIT: Teensy 4.1 was released in May 2020 (this message was originally written in October 2019, just shortly after Teensy 4.0 release).
Exactly which pins, what features (like a SD socket vs integrating an ethernet PHY vs maybe SGTL5000 or other codec on SAI3) and how to use the PCB real estate are pretty much a blank slate at this very early stage.
But one thing I'm not looking to do is an Intel Edison style high density connector for all or most of the I/O. The general format of 0.1 inch spacing for outside pins, and more-but-less-critical pins on bottom side pads will remain the basic idea of the Teensy form factor. But for 1170, if the PCB is larger, maybe we'll do dual-rows (similar to Beaglebone) with the outside rows meant to be primary signals for breadboard use. Maybe?
Still so many options to consider. Now that we can talk of 1170 without violating any NDAs, let the conversation begin!
EDIT Again: every appearance is these new IMXRT117X chips will not be in volume production until the end of 2021 or early 2022.
EDIT Yet Again: these chips are still not in stock at the beginning of 2022, and we're now about 9 months into a severe global shortage of nearly all chips. When PJRC will be able to launch another Teensy model is looking uncertain, but the first half of 2022 is looking extremely unlikely to alleviate the shortages of nearly all chips on the market.
I'm definitely planning to make a larger form factor Teensy with the 1170 chip.
I'm also considering making Teensy 4.1 with the same chip (or 12 mm package size) as we have on Teensy 4.0, but in the Teensy 3.6 form factor so we can have access to more pins and features. If Teensy 4.1 is made (still "if" at this point), it would be early 2020 time frame. EDIT: Teensy 4.1 was released in May 2020 (this message was originally written in October 2019, just shortly after Teensy 4.0 release).
Exactly which pins, what features (like a SD socket vs integrating an ethernet PHY vs maybe SGTL5000 or other codec on SAI3) and how to use the PCB real estate are pretty much a blank slate at this very early stage.
But one thing I'm not looking to do is an Intel Edison style high density connector for all or most of the I/O. The general format of 0.1 inch spacing for outside pins, and more-but-less-critical pins on bottom side pads will remain the basic idea of the Teensy form factor. But for 1170, if the PCB is larger, maybe we'll do dual-rows (similar to Beaglebone) with the outside rows meant to be primary signals for breadboard use. Maybe?
Still so many options to consider. Now that we can talk of 1170 without violating any NDAs, let the conversation begin!