Reducing Wearable Sequencer Enclosure Size?

Thought I'd reach out as this will be my first time diving into PCB design/CAD software/custom circuit creation...

I'm building a "standalone MIDI drum glove sequencer" doubling as MIDI controller, but for now it's codename "Chonky". So far feature-wise, it can record/overdub/loop up to 4 layers of velocity-sensitive SMF format MIDI data, FROM force sensitive resistors placed in the fingertips, TO a microSD card mounted on the Rev D2 Audio Shield. Thanks to Teensy's audio library, each finger plays a different drum sample (for audible feedback) based on pitch & velocity of the MIDI Note-On events being recorded to the SD card. Variable tempo control via rotary encoder is currently in the works. There's other fluff involved, but that's the jist.

My most pressing concern is enclosure size. The goal is to pack this contraption into a wearable enclosure that can be comfortably mounted on the dorsal side of the hand. Sensors can then be plugged into ports as depicted below, and threaded through slits in the glove.

Here's a BOM, albeit shoddy, with schematic links of the largest components I'll be trying to incorporate into the PCB and/or enclosure:

- Teensy 4.1
- Rev D2 Audio Shield
- Adafruit Powerboost 1000C
- Adafruit STEMMA Speaker
- Lithium Ion Polymer Battery - 3.7v 2500mAh
- Micro-USB Panel Mount Cable

So! Here's where I'm seeking guidance / my main question:

How does one go about reverse engineering multiple boards (Teensy's Audio shield, Adafruit products, etc...) into a single circuit in order to have a custom PCB milled?

Does the process look something like:

1) Compile a list & place Digikey order for every component of each board used to prototype (down to the chips, resistors, capacitors, etc),
2) Design the circuit(s)/PCB(s) to be milled by a PCB manufacturer like PCBWay, and finally
3) Solder your SMD & Through-Hole components to the newly milled custom PCB(s)

..? Whatever learning this entails, I'm there. Just figured I'd ask here in case anyone has faced similar challenges in their projects!

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