BGA...
Out of the box thinking (uh-oh) ...
Using tiny chip-o-board (die) with wire bonding... We're doing that on a project I'm on. Of course, much, much smaller than a leaded-package.
The issue is product volume, and availability of K20 chips on wafers, pre-tested.
We've used a a few local wire bonding shops for low volume prototypes. It can be affordable at low volumes.
There's also ACF instead of traditional wire-bonding - Anisotropic conductive film, commonly known as ACF. We've started with one local company that does ACF.
http://flipchips.com/tutorial/assem...-film-for-flipchip-applications-introduction/
But, it's probably easier to use BGA. Might need a very, very good PCB fab at those tolerances. Solder flux balls' sizes and the stencil have to be well done.
Out of the box thinking (uh-oh) ...
Using tiny chip-o-board (die) with wire bonding... We're doing that on a project I'm on. Of course, much, much smaller than a leaded-package.
The issue is product volume, and availability of K20 chips on wafers, pre-tested.
We've used a a few local wire bonding shops for low volume prototypes. It can be affordable at low volumes.
There's also ACF instead of traditional wire-bonding - Anisotropic conductive film, commonly known as ACF. We've started with one local company that does ACF.
http://flipchips.com/tutorial/assem...-film-for-flipchip-applications-introduction/
But, it's probably easier to use BGA. Might need a very, very good PCB fab at those tolerances. Solder flux balls' sizes and the stencil have to be well done.
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