Constantin
Well-known member
I presume that the usual BGA madness applies, i.e. Lots of layers with signals that then get extracted with vias. Some of these vias will go all the way through (power caps on opposite side), some will be blind, allowing the signals emerge, spider-web like.
Trouble is, I don't think osh park allows blind vias, which likely would make your job a lot easier by allowing you to gradually thin out the number of "tree trunks" bisecting all layers and creating road blocks for your signals. Perhaps Paul can offer advice since his latest MCU effort involves a BGA as well?
I'd also read this cautionary tale at EEV blog. It appears that adhering even to the minimums over at OSH park can lead to trouble. Granted, they retried three times but each time, the board houses OSH used apparently didn't care enough to use a 10 mil drill when asked for and substituted a 13 mil drill instead. One obvious caveat is that this post is from 2014, however. Laen may have improved his QC or choice of fab houses since. http://www.eevblog.com/forum/projects/pcb-fab-hackvana-vs-oshpark/
But I'd have a look at Hackavana.
Trouble is, I don't think osh park allows blind vias, which likely would make your job a lot easier by allowing you to gradually thin out the number of "tree trunks" bisecting all layers and creating road blocks for your signals. Perhaps Paul can offer advice since his latest MCU effort involves a BGA as well?
I'd also read this cautionary tale at EEV blog. It appears that adhering even to the minimums over at OSH park can lead to trouble. Granted, they retried three times but each time, the board houses OSH used apparently didn't care enough to use a 10 mil drill when asked for and substituted a 13 mil drill instead. One obvious caveat is that this post is from 2014, however. Laen may have improved his QC or choice of fab houses since. http://www.eevblog.com/forum/projects/pcb-fab-hackvana-vs-oshpark/
But I'd have a look at Hackavana.
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