Forum Rule: Always post complete source code & details to reproduce any issue!
Page 2 of 2 FirstFirst 1 2
Results 26 to 30 of 30

Thread: T_3.6 acting oddly: Program Button doing a reset, no bootloader reprogram

  1. #26
    Senior Member+ defragster's Avatar
    Join Date
    Feb 2015
    Posts
    9,695
    Quote Originally Posted by bicycleguy View Post
    Thought I should chime in


    Does your T_3.6 board have "a very slight curvature "?

  2. #27
    Junior Member
    Join Date
    Nov 2016
    Posts
    10
    I was struggling with something very similar... I found that there was a very very slight warping to my board, and by applying pressure to the edges, I was able to straighten it completely, and when the board is straightened it programs perfectly every time. Might be worth a try?

    Edit:
    Didn't see #26 on the next page... but that is the thread where we figured out what happened with mine.
    Last edited by Ephuvex; 12-01-2016 at 05:29 AM.

  3. #28
    Senior Member
    Join Date
    Dec 2015
    Posts
    128
    https://youtu.be/7RFW-Kr8QA4

    This video clip pretty much shows the issue. Note the program rebooting in the terminal window or the Teesny loading.
    Just pressing the switch or pressing on the processor chip away from the switch reboots, while toward the switch loads. After the video, determined the pencils weren't necessary, but made slightly less pressure required. The most sensitive location on the chip to push was in the
    corner toward the switch and camera.

    This looks like a bad solder joint to me. With ball grid arrays, one intermittent connection means others are likely.
    Last edited by bicycleguy; 12-01-2016 at 07:12 PM. Reason: added about other signals

  4. #29
    Junior Member
    Join Date
    Nov 2016
    Posts
    10
    Virtually the exact same behavior I was dealing with... Pressure on the chip solved the issue.

  5. #30
    Senior Member+ Frank B's Avatar
    Join Date
    Apr 2014
    Location
    Germany NRW
    Posts
    5,679
    @Paul: Looks like the widely known xbox "ring of death" problem ...

    Perhaps something on the bga-soldering process can be optimized.
    Last edited by Frank B; 12-01-2016 at 10:22 PM.

Posting Permissions

  • You may not post new threads
  • You may not post replies
  • You may not post attachments
  • You may not edit your posts
  •