What do I do with the Die attach pad?

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Hi guys,

Nooby question here, should be pretty straightforward.

I'm building a teensy powered device of my own and am currently creating an eagle component for the MKL02Z32VFG4 bootloader chip.
What on earth do I do with the Die attach pad on the bottom?
I'm guessing I want to connect it to to the board to disperse heat but should it be connected to ground or am I wrong entirely?

Many thanks,

Giga.
 
You should have a look at the data sheet. But normally, these "die pads" should be soldered to a ground plane, or in case of a multilayer board to a copper area which is linked to a ground plane with 3 or 4 vias.
 
What on earth do I do with the Die attach pad on the bottom?

Connect it to GND.

I'm guessing I want to connect it to to the board to disperse heat but should it be connected to ground or am I wrong entirely?

Heat isn't an issue with that chip. It uses very little power.

The center pad is needed only for mechanical stability on this part.
 
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