BGA Decoupling Capacitors

brtaylor

Well-known member
I'm in the process of laying out my first custom Teensy using the BGA version of the MK66FX1M0 (i.e. Teensy 3.6) microcontroller. Typically, when I'm using the LQFP version of that chip, I place decoupling capacitors between each supply and ground pin (they're co-located) and then to ground and power planes with vias. In this case, all of the supply and ground pins are clustered in the center of chip.

Screenshot_2020-11-15_15-52-53.png

What's the best approach for this? I'm thinking of putting vias in between the BGA pads to bring each straight down to supply and ground planes and then put the decoupling capacitors as close to the microcontroller as possible and use vias to tie those into the supply / ground planes. But being my first time playing with a BGA like this, I thought I would see what the best practice is.

Thanks!
Brian
 
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