Hello Paul, Hello Teensy fans,
We have the idea to put most of the components of the Teensy 4.0 or Teensy 3.6 board in a small package (Embadded QFN or BGA Chip). This way, in case of projects that require miniaturized electronics, the standard Teensy board can be used for development and the embedded chip (system in package) can be placed on the PCB of the final product. This will be the smallest arduino compatible board ever!
Here is a photo of a similar embedded module or System in Package:
https://www.izm.fraunhofer.de/de/abteilungen/system_integrationinterconnectiontechnologies.html
Fraunhofer IZM is the world's leading institute for the integration of robust and reliable electronics and we can develop and manufacture the System in Package in our institute. We would be happy to send you some samples of the System in Package and share the design files with pjrc once we are ready.
We need pjrc's help with the teensy board and getting the components.
Could you please send me an official quote to purchase 500 pieces of the following components (for each of Teensy 4.0 & Teensy 3.6):
MCU, bootloader chips and crystals.
Could you provide the BOM list (e.g. mouser or digikey links) of the Teensy 3.6 & Teensy 4.0 boards?
Do you perhaps have an Altium or Eagle schematic and layout files of both boards that you can provide?
Once we have decided whether to miniaturize the Teensy 3.6 or 4.0 board, I will post the final reduced schematic for discussion.
I would appreciate feedback from others interested in this project
Thanks ,
Basel Adams
We have the idea to put most of the components of the Teensy 4.0 or Teensy 3.6 board in a small package (Embadded QFN or BGA Chip). This way, in case of projects that require miniaturized electronics, the standard Teensy board can be used for development and the embedded chip (system in package) can be placed on the PCB of the final product. This will be the smallest arduino compatible board ever!
Here is a photo of a similar embedded module or System in Package:
https://www.izm.fraunhofer.de/de/abteilungen/system_integrationinterconnectiontechnologies.html
Fraunhofer IZM is the world's leading institute for the integration of robust and reliable electronics and we can develop and manufacture the System in Package in our institute. We would be happy to send you some samples of the System in Package and share the design files with pjrc once we are ready.
We need pjrc's help with the teensy board and getting the components.
Could you please send me an official quote to purchase 500 pieces of the following components (for each of Teensy 4.0 & Teensy 3.6):
MCU, bootloader chips and crystals.
Could you provide the BOM list (e.g. mouser or digikey links) of the Teensy 3.6 & Teensy 4.0 boards?
Do you perhaps have an Altium or Eagle schematic and layout files of both boards that you can provide?
Once we have decided whether to miniaturize the Teensy 3.6 or 4.0 board, I will post the final reduced schematic for discussion.
I would appreciate feedback from others interested in this project
Thanks ,
Basel Adams