Hi there... I have been working with Teensy 4.0 and it has been a dream, I have learned so much. But I digress..
I have a project where I am using all the underside surface mount pads... it has been quite a challenge to attach to them via solder with a header that is reliable... but more specifically where I don't cause all kinds of maddening solder bridges.
After building several PCB's I find that my consistent issue revolves around Pin 31, C17 and C29. When I attempt to solder onto Pin 31, I inevitably bridge between C17 and C19 which is a problem since they are so close together.
Even with Pin 33 and L3, it becomes a problem.
Do you think that in future versions, that you could potentially move these components a scoche out away from the solder pads?
Thank you, I so much appreciate your consideration.
Jess
Fort Collins, CO
I have a project where I am using all the underside surface mount pads... it has been quite a challenge to attach to them via solder with a header that is reliable... but more specifically where I don't cause all kinds of maddening solder bridges.
After building several PCB's I find that my consistent issue revolves around Pin 31, C17 and C29. When I attempt to solder onto Pin 31, I inevitably bridge between C17 and C19 which is a problem since they are so close together.
Even with Pin 33 and L3, it becomes a problem.
Do you think that in future versions, that you could potentially move these components a scoche out away from the solder pads?
Thank you, I so much appreciate your consideration.
Jess
Fort Collins, CO